Closed

Wafer Dicing Saw and Post Wafer Cleaning

UNIVERSITY OF SOUTHAMPTON · £205,000 · closes 28 May 2024

£205,000

Estimated value

Closed

Deadline

25 Apr 2024

Published

This tender has closed.

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About this contract

The University of Southampton seeks to acquire a complete dicing system for the University's optical and semiconductor materials processing capabilities for a number of high-impact projects in the major engineering themes of Quantum Technologies, Photonics and Advanced Manufacturing. This system is a replacement for the current dicing saw for Building 53 back-end of line cleanroom facility and an upgrade to meet the demands of current projects and technologies. Dicing is a fundamental part of the cleanroom and underpins a significant number of ongoing and future grants. The acquisition of this system will enable university researchers to machine surfaces and micron sized ridge structures with nanoscale surface roughness and low amounts of topside chipping in optical and semiconductor materials. This dicing machine will allow the fabrication of new devices that will tackle fundamental research problems in quantum light-matter interactions, quantum sensors, and telecommunications.

Key dates

Published25 Apr 2024
Submission deadline28 May 2024 Add to calendar ↓

Source

Source notice on Find a TenderView ↗

Lot — bid on it if it fits

This contract has one lot. Bid if it suits your firm.

The University of Southampton seeks to acquire a complete dicing system for the University's optical and semiconductor materials processing capabilities for a number of high-impact projects in the major engineering themes of Quantum Technologies, Photonics and Advanced Manufacturing. This system is a replacement for the current dicing saw for Building 53 back-end of line cleanroom facility and an upgrade to meet the demands of current projects and technologies. Dicing is a fundamental part of the cleanroom and underpins a significant number of ongoing and future grants. The acquisition of this system will enable university researchers to machine surfaces and micron sized ridge structures with nanoscale surface roughness and low amounts of topside chipping in optical and semiconductor materials. The University is conducting this procurement using the Open procedure in accordance with the requirements of the Regulations for the purpose of procuring the Goods described in the Specification. The University proposes to enter into a Contract for up to 1 year and 6 months with the successful tenderer. This will comprise of an estimated delivery lead time of up to 6 months followed by a 1 year warranty period. Should the estimated delivery date be exceeded, the contract length will be extended and the initial 1 year warranty period will begin upon delivery and completion of Site Acceptance Testing. The Contract will be effective upon signing. The estimated value of the proposal is £205,000.00 (excluding VAT). Whilst bidders are expected to provide a proposal that falls within this budget, for the benefit of doubt, the University reserves the right to automatically exclude any bidders who's proposal exceeds this figure. All related components, delivery, installation, commission, training and warranties MUST be included within the proposal. Details of current expenditure or potential future uptake are given as a guide based on past purchasing and current planning to assist you in the preparation of your Tender. They should not be interpreted as an undertaking to purchase any goods or services to any particular value and do not form part of the Contract. Additional information: This Contract is NOT suitable for splitting into Lots. This is the purchase of a single piece of equipment therefore dividing the requirement into Lots would not be possible from a technical perspective.£205,000

Who to contact

NameAmy Hands
Phone+44 2380595000

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