Closed

UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components

UK Research & Innovation · £180,000 · closes 19 Jan 2024

£180,000

Estimated value

Closed

Deadline

8 Dec 2023

Published

This tender has closed.

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About this contract

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.

Key dates

Published8 Dec 2023
Submission deadline19 Jan 2024 Add to calendar ↓

Source

Tender documents portalOpen ↗
Source notice on Contracts FinderView ↗

Who to contact

EmailSTFCProcurement@ukri.org
Phone+441793442000

Tender documents

tenderNoticeOpen ↗
tenderNoticeOpen ↗

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