Closed

UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components

UK Research & Innovation · £180,000 · closes 19 Jan 2024

£180,000

Estimated value

Closed

Deadline

8 Dec 2023

Published

This tender has closed.

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About this contract

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.

Key dates

Published8 Dec 2023

Submission deadline19 Jan 2024 Add to calendar ↓

Source

Source notice on Find a TenderView ↗

Lot — bid on it if it fits

This contract has one lot. Bid if it suits your firm.

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision£180,000

Who to contact

NameSTFC Procurement

EmailSTFCProcurement@ukri.org

Phone+44 1793442000

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