Closed
Supply, Delivery and Installation of Laser Depanelling & Singulation
University of Strathclyde · £825,000 · closes 1 Oct 2024
£825,000
Estimated value
Closed
Deadline
30 Aug 2024
Published
This tender has closed.
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About this contract
The University of Strathclyde has a requirement for laser equipment that can depanel printed circuit boards, singulate over moulded lead frames, laser mark components and weld metal lids to metal packages.
Key dates
Published30 Aug 2024
Submission deadline1 Oct 2024 Add to calendar ↓
Source
Source notice on Find a TenderView ↗
Lot — bid on it if it fits
This contract has one lot. Bid if it suits your firm.
The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements.
This is in support of a publicly funded project that will see the creation of an advanced, scaled up packaging facility for power electronics within the National Manufacturing Institute Scotland. The overall scale up manufacturing facility is to be housed at an NMIS site; this semiconductor advanced packaging area will be housed in an ISO-7 (previously class 10,000) clean room environment. The equipment will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres.
The University of Strathclyde has a requirement for laser equipment that can depanel printed circuit boards, singulate over moulded lead frames, laser mark components and weld metal lids to metal packagesValue not published
Who to contact
Phone+44 7811592949
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